## Technical Overview: ATS-15F-80-C3-R0 The **ATS-15F-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** product line, designed for cooling high-power semiconductors and integrated circuits. --- ### 1. Key Technical Specifications | Parameter | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15F-80-C3-R0 | | **Product Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Anodized) | | **Thermal Resistance** | 1.92°C/W (at 200 LFM) | | **Dimensions** | 36.83mm x 46.45mm | | **Height** | 9.50mm | --- ### 2. Design and Construction Features #### A. Fin Geometry (maxiFLOW™) This part utilizes a unique **flared fin** structure. Unlike traditional straight-fin heat sinks, the maxiFLOW design increases the surface area and creates turbulence in the airflow, which significantly improves heat dissipation efficiency in constrained spaces. #### B. The pushPIN™ Attachment System The "R0" designation refers to the specific attachment mechanism: * **Secure Fit:** Uses a brass pin and a stainless steel spring. * **Constant Pressure:** Ensures a reliable interface between the heat sink and the chip, maximizing thermal transfer. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates that the heat sink comes pre-applied with a **Phase Change Material (PCM)** or high-performance thermal pad. This eliminates the need for manual application of thermal grease during assembly. --- ### 3. Thermal Performance Metrics Thermal resistance is critical for determining if this part can cool a specific processor. | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 1.92 | | 400 | 2.0 | 0.98 | | 600 | 3.0 | 0.73 | --- ### 4. Typical Applications This component is generally used for cooling: * **ASICs & FPGAs:** High-density logic chips. * **Processors:** Low to medium-profile CPUs in embedded systems. * **Network Equipment:** Switches and routers where vertical space is limited (9.5mm height).