ATS-15F-81-C2-R0
AI

The **ATS-15F-81-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in constrained spaces.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 14.03°C/W (Unducted @ 100 LFM) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm |
| **Fin Style** | maxiFLOW (Tapered Fin Design) |
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### 2. Key Design Features
* **maxiFLOW™ Geometry:** The fins are tapered and spread outward. This design reduces pressure drop and maximizes the surface area exposed to the airflow, which is critical for cooling high-power density components.
* **pushPIN™ Attachment:** This model uses a tool-free mounting system. It features a brass pin and a stainless steel spring that ensures consistent pressure between the heat sink and the electronic component (CPU, FPGA, or GPU), improving thermal transfer.
* **Pre-Applied Thermal Interface Material (TIM):** This part usually comes with **T766** phase-change material or a high-performance thermal pad pre-applied to the base, ensuring immediate readiness for assembly.
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### 3. Applications and Usage
This heat sink is typically used in the following electronic environments:
1. **Telecommunications:** Cooling of networking chips and high-speed data processors.
2. **Embedded Computing:** Use in small form factor (SFF) industrial PCs where vertical space is limited to 20mm.
3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators in DC-DC converters.
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### 4. Thermal Performance Comparison
Thermal resistance varies based on the Air Velocity (LFM - Linear Feet per Minute):
| Velocity (LFM) | Resistance (°C/W) - Ducted | Resistance (°C/W) - Unducted |
| :--- | :--- | :--- |
| 100 | 3.05 | 14.03 |
| 200 | 2.05 | 6.41 |
| 400 | 1.45 | 3.52 |
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- ⤷What is the difference between ducted and unducted thermal resistance?
- ⤷ Does this heat sink come with different spring tensions for the pushPIN system?
- ⤷ Are there alternative finishes to Blue Anodized for specific EMI requirements?