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  • ATS-15F-81-C2-R0

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    The **ATS-15F-81-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.03°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The fins are tapered and spread outward. This design reduces pressure drop and maximizes the surface area exposed to the airflow, which is critical for cooling high-power density components. * **pushPIN™ Attachment:** This model uses a tool-free mounting system. It features a brass pin and a stainless steel spring that ensures consistent pressure between the heat sink and the electronic component (CPU, FPGA, or GPU), improving thermal transfer. * **Pre-Applied Thermal Interface Material (TIM):** This part usually comes with **T766** phase-change material or a high-performance thermal pad pre-applied to the base, ensuring immediate readiness for assembly. --- ### 3. Applications and Usage This heat sink is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of networking chips and high-speed data processors. 2. **Embedded Computing:** Use in small form factor (SFF) industrial PCs where vertical space is limited to 20mm. 3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators in DC-DC converters. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Velocity (LFM) | Resistance (°C/W) - Ducted | Resistance (°C/W) - Unducted | | :--- | :--- | :--- | | 100 | 3.05 | 14.03 | | 200 | 2.05 | 6.41 | | 400 | 1.45 | 3.52 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between ducted and unducted thermal resistance?
    • ⤷ Does this heat sink come with different spring tensions for the pushPIN system?
    • ⤷ Are there alternative finishes to Blue Anodized for specific EMI requirements?