The **ATS-15F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Thermal Resistance** | 6.89°C/W (at 100 LFM) | | **Thermal Interface Material** | T412 (Phase Change Material) | --- ## 2. Key Electronic & Mechanical Features ### A. pushPIN™ Attachment Unlike adhesive-based heat sinks, this part uses the **pushPIN™** system. This provides: * **Constant Pressure:** Ensures optimal contact between the heat sink base and the electronic chip. * **Reliability:** Resistant to vibration and mechanical shock compared to "peel-and-stick" solutions. * **Standard Spacing:** Fits pre-drilled holes on a PCB (usually 43mm or 33mm diagonal spacing depending on the specific pin kit). ### B. maxiFLOW™ Fin Geometry The fins are designed with a specific "flared" profile. This increases the surface area significantly without obstructing airflow, which is critical for components packed into tight enclosures or server blades. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**. This is a high-performance thermal pad that softens at operating temperatures to fill microscopic air gaps between the heat sink and the component, maximizing heat transfer. --- ## 3. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how efficiently the part cools. Lower values are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.89 | | 300 (1.5 m/s) | 3.38 | | 500 (2.5 m/s) | 2.21 | --- ### Application Note This heat sink is typically used for **medium-profile** components where vertical clearance is limited (10mm height) but high reliability is required. It is commonly found in network switches, telecommunications hardware, and industrial computing modules.