The **ATS-15G-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for securing the cooling element to a PCB. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Type** | Top Mount / Push Pin | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 12.7mm | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 17.00°C/W (at 100 LFM) | --- ### 2. Design and Engineering Features ### A. Material and Coating The unit is constructed from **AL6063 aluminum**, which offers an excellent balance between thermal conductivity and weight. The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity for better radiation heat transfer. ### B. Thermal Performance This heat sink is designed for **Fine Pitch** applications. The thermal resistance varies based on airflow: * **Low Flow (100 LFM):** ~17.00°C/W * **High Flow (700 LFM):** ~1.90°C/W This indicates that the part is highly efficient in environments with active cooling (fans). ### C. Mechanical Attachment The "C2" in the part number indicates the specific push-pin and spring configuration: * **Push-Pin:** Allows for easy installation and consistent pressure across the interface material (TIM). * **Spring Type:** Provides high-tension force to ensure the heat sink remains flush against the component (BGA/Processor). --- ### 3. Common Applications This specific footprint (45mm x 45mm) and low profile (12.7mm) make it suitable for: 1. **Networking Hardware:** Switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and high-speed chipsets. 4. **Telecom:** Base station processing units. ---