The **ATS-15G-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number itself follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Model series: pushPIN™ | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Fin Type** | XC-CUT (Cross-Cut) | Optimized for multi-directional airflow | | **Attachment Method** | pushPIN™ | Uses plastic pins and springs for secure mounting | | **Thermal Resistance** | 1.40°C/W (at 200 LFM) | Lower value indicates better cooling | | **Dimensions** | 45mm x 45mm x 20mm | Standard square footprint | | **Finish** | Blue Anodized | Protects against corrosion and improves radiation | --- ### 2. Key Electronic Components Features #### A. The pushPIN™ System Unlike traditional adhesive-based heat sinks, this part uses a mechanical spring-loaded system. * **Mechanical Integrity:** Provides a specific, consistent pressure (preload) on the electronic chip, ensuring the thermal interface material (TIM) works efficiently. * **Ease of Maintenance:** Can be removed and reattached without damaging the PCB. #### B. Cross-Cut (XC) Fin Design The fins on this heat sink are cut in both vertical and horizontal directions. * **Airflow Flexibility:** Standard straight fins require air to flow in one specific direction. The XC-cut allows air from any angle to pass through, making it ideal for crowded electronic enclosures. * **Surface Area:** Increases the total surface area available for heat transfer to the ambient environment. #### C. Thermal Interface Material (TIM) The "C2" in the part number typically refers to the **T766 thermal phase change material** or a high-performance thermal grease pre-applied to the base. * **Function:** Fills microscopic air gaps between the component surface and the heat sink base to minimize thermal impedance. --- ### 3. Application Use Cases This part is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs. 3. **Embedded Systems:** Industrial PCs where mechanical vibration resistance is required (provided by the pushPIN™ attachment). ---