### Technical Overview: ATS-15G-35-C2-R0 The **ATS-15G-35-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs where space is limited but thermal demands are high. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-15G-35-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 12.00 °C/W (Unducted Flow @ 200 LFM) | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ### 2. Physical Design & Construction * **maxiFLOW™ Geometry:** The heat sink features a unique spread-fin design. This geometry maximizes the surface area for heat dissipation while minimizing the pressure drop, allowing for better airflow through the fin array. * **pushPIN™ Attachment:** The "R0" at the end of the part number indicates the use of a pushPIN™ mounting system. This system includes a flexible, high-performance compression spring that provides consistent pressure to ensure optimal thermal contact between the heat sink and the component. * **Blue Anodized Finish:** The aluminum body is treated with a blue anodized coating, which provides corrosion resistance and increases thermal emissivity. --- ### 3. Thermal Performance (Airflow Data) The efficiency of this part is highly dependent on the velocity of the air moving through the system (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 200 (1.0 m/s) | 12.00 °C/W | 3.50 °C/W | | 400 (2.0 m/s) | 6.50 °C/W | N/A | | 600 (3.0 m/s) | 4.80 °C/W | N/A | --- ### 4. Component Composition (Bill of Materials) 1. **Heat Sink Body:** Extruded Aluminum (6063). 2. **Springs:** Stainless steel or music wire with a reliable compression rate. 3. **Pins:** Nylon or Brass (depending on specific revision) to secure the unit to the PCB. 4. **Thermal Interface Material (TIM):** Pre-applied T766 phase-change material or high-conductivity tape to eliminate air gaps. --- ### 5. Application Use Cases * **Telecommunications:** Cooling of high-speed networking chips. * **Computing:** Secondary cooling for chipsets on motherboards. * **Industrial:** Protection for power-sensitive components in confined enclosures.