The **ATS-15G-85-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is not an active circuit component (like a chip) but rather a high-performance **Heat Sink** designed for cooling electronic devices such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | ~4.50°C/W (at 200 LFM) | | **Dimensions** | 40mm x 40mm | | **Height** | 10.00mm | | **Fin Style** | Straight Fin | --- ## 2. Component Features ### A. maxiFLOW™ Design The "maxiFLOW" geometry features a spread-fin design that maximizes the surface area for cooling. This is specifically engineered for high-performance thermal management in constrained spaces where airflow is present. ### B. pushPIN™ Attachment Unlike adhesive tapes that can degrade over time, the **-R0** suffix indicates the use of the **pushPIN™** system. This consists of: * **Brass/Plastic Pins:** Secure the heat sink to the PCB. * **Compression Springs:** Provide precise vertical pressure to ensure optimal contact between the heat sink and the component. * **Reliability:** It is more vibration-resistant than adhesive methods. ### C. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **Phase Change Material (PCM)** or high-performance thermal grease. This fills the microscopic air gaps between the heat sink base and the electronic component to ensure efficient heat transfer. --- ## 3. Physical Dimensions (Summary) To ensure this part fits your PCB layout, consider these mechanical specs: * **Footprint:** 40.0mm x 40.0mm * **Vertical Clearance:** 10.0mm (Low profile) * **Hole Pattern:** Standardized to fit specific ATS pushPIN spacing requirements. --- ## 4. Typical Applications This component is found in electronic systems where high-heat-density chips are used: 1. **Telecommunications:** Cooling network switches and routers. 2. **Computing:** Cooling chipsets or small form-factor CPUs. 3. **Industrial:** Thermal management for power modules or high-speed controllers.