ATS-15G-89-C2-R0
AI

### Technical Overview: ATS-15G-89-C2-R0
The **ATS-15G-89-C2-R0** is a high-performance **heat sink** assembly manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, specifically designed for cooling high-heat-generating electronic components such as CPUs, GPUs, FPGAs, and ASICs.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Product Category** | Board Level Heat Sink |
| **Material** | Aluminum (Blue Anodized) |
| **Thermal Resistance** | 3.90°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm |
| **Fin Style** | maxiFLOW™ (Tapered Fin) |
| **Base Type** | Solid |
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### 2. Functional Components
#### A. The Heat Sink Body
The core of the part is an extruded aluminum heat sink. The **maxiFLOW™** design uses a tapered fin geometry. This maximizes the surface area for convection while minimizing pressure drop, allowing for more efficient airflow across the electronic component.
#### B. The pushPIN™ Attachment
Unlike adhesive tapes or simple clips, the `C2-R0` variant uses a **pushPIN™** system. This consists of:
* **Plastic/Brass Push Pins:** Used to secure the sink to pre-drilled holes in the PCB.
* **Compression Springs:** These provide precise, uniform pressure (Pre-load) across the component surface, ensuring optimal thermal interface contact.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number typically indicates that the part comes with a **pre-applied Thermal Interface Material**. This is a phase-change material or high-performance thermal grease that fills microscopic air gaps between the heat sink base and the electronic chip.
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### 3. Application Use Cases
This specific part is engineered for environments where thermal management is critical:
* **Telecommunications:** Cooling network switches and routers.
* **Data Centers:** High-density server blade cooling.
* **Embedded Systems:** Industrial PCs and automation controllers.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **15G** | Product Series / Family |
| **89** | Specific Geometry/Size Code |
| **C2** | Thermal performance level/Material (Blue Anodized Aluminum) |
| **R0** | Packaging and Pre-applied TIM status |
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What is the significance of the blue anodized finish on this heat sink?
- ⤷ How do I calculate if the 3.90\u00b0C/W thermal resistance is sufficient for my chip?
- ⤷ Are there alternative attachment methods if my PCB doesn't have holes for the pushPIN?