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  • ATS-15G-89-C2-R0

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    ### Technical Overview: ATS-15G-89-C2-R0 The **ATS-15G-89-C2-R0** is a high-performance **heat sink** assembly manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, specifically designed for cooling high-heat-generating electronic components such as CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Category** | Board Level Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 3.90°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Fin Style** | maxiFLOW™ (Tapered Fin) | | **Base Type** | Solid | --- ### 2. Functional Components #### A. The Heat Sink Body The core of the part is an extruded aluminum heat sink. The **maxiFLOW™** design uses a tapered fin geometry. This maximizes the surface area for convection while minimizing pressure drop, allowing for more efficient airflow across the electronic component. #### B. The pushPIN™ Attachment Unlike adhesive tapes or simple clips, the `C2-R0` variant uses a **pushPIN™** system. This consists of: * **Plastic/Brass Push Pins:** Used to secure the sink to pre-drilled holes in the PCB. * **Compression Springs:** These provide precise, uniform pressure (Pre-load) across the component surface, ensuring optimal thermal interface contact. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the part comes with a **pre-applied Thermal Interface Material**. This is a phase-change material or high-performance thermal grease that fills microscopic air gaps between the heat sink base and the electronic chip. --- ### 3. Application Use Cases This specific part is engineered for environments where thermal management is critical: * **Telecommunications:** Cooling network switches and routers. * **Data Centers:** High-density server blade cooling. * **Embedded Systems:** Industrial PCs and automation controllers. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **15G** | Product Series / Family | | **89** | Specific Geometry/Size Code | | **C2** | Thermal performance level/Material (Blue Anodized Aluminum) | | **R0** | Packaging and Pre-applied TIM status |
    ✨ Follow-up Questions
    • ⤷ What is the significance of the blue anodized finish on this heat sink?
    • ⤷ How do I calculate if the 3.90\u00b0C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there alternative attachment methods if my PCB doesn't have holes for the pushPIN?