The **ATS-15H-08-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, which is designed for securing cooling components to Printed Circuit Boards (PCBs) with high reliability and specific pressure. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al 6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00 mm x 45.00 mm x 15.00 mm | | **Mounting Type** | Push-Pin (Plastic) | | **Spring Type** | Stainless Steel (ATS-PP-08) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Flow Orientation** | Fine-Pitch (Straight Fin) | --- ### 2. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). The effectiveness of this heat sink depends on the velocity of the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :---: | :---: | :---: | :---: | | **Thermal Resistance (Unducted)** | 14.61 °C/W | 5.39 °C/W | 3.10 °C/W | 2.26 °C/W | | **Thermal Resistance (Ducted)** | 3.64 °C/W | 2.39 °C/W | 1.94 °C/W | 1.70 °C/W | --- ### 3. Key Component Parts The assembly consists of three main electronic/mechanical sub-parts: 1. **The Heat Sink Body:** A fine-pitch aluminum block designed to maximize surface area. The "08" in the part number corresponds to a specific fin height and spacing profile. 2. **The Push-Pin (ATS-PP-08):** A plastic fastener that passes through the PCB. It uses a spring-loaded mechanism to ensure consistent pressure between the heat sink and the component (CPU/GPU/FPGA). 3. **Thermal Interface Material (T766):** A phase-change or grease-like pad pre-applied to the base. This fills microscopic air gaps between the chip and the heat sink to ensure efficient heat transfer. --- ### 4. Implementation Example If you are integrating this into a CAD design or PCB layout, ensure the following hole pattern is used: ```markdown Hole Diameter: 3.175 mm (0.125") Pitch (Center-to-Center): 38.00 mm ``` ---