The **ATS-15H-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Type** | Straight | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 6.77 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.23 °C/W @ 100 LFM | | **Pressure Flow** | High Flow / Low Pressure Drop | --- ### 2. Part Number Breakdown Understanding the nomenclature helps identify the exact features of the component: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **15**: Internal product series. * **H**: Fin pitch/profile indicator (High performance). * **101**: Specific model geometry (45x45x30mm). * **C3**: Material/Finish code (Typically indicates Aluminum with a specific thermal interface material). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions The ATS-15H-101-C3-R0 serves several critical roles in an electronic assembly: * **Heat Dissipation:** It increases the surface area of a hot component, allowing air to carry away heat more effectively via convection. * **Thermal Interface:** It is usually paired with a Thermal Interface Material (TIM) to bridge the microscopic air gaps between the chip and the metal surface. * **Mechanical Stability:** The `pushPIN™` mechanism uses a brass attachment and a stainless steel spring to provide consistent pressure, ensuring optimal thermal contact while preventing damage from vibration. --- ### 4. Typical Application Example In a real-world scenario, this part would be mounted on a PCB as follows: ```yaml Component: FPGA / Processor Cooling Method: Active (Fan-assisted) or Passive Attachment: - Through-hole mounting (PCB holes) - Spring-loaded pins for constant tension Interface: Pre-applied Thermal Phase Change Material ``` ---