The **ATS-15H-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, engineered for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 30.00mm | | **Pitch (Pattern)** | Square (45mm hole spacing) | | **Thermal Resistance** | 10.03 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (High-performance pre-applied) | --- ### 2. Electronic/Mechanical Components The assembly consists of four primary elements that work together to provide efficient cooling for electronic boards: 1. **The Heat Sink Body:** A cross-cut fin design. This geometry allows for multi-directional airflow, which is critical in modern electronics where air might be turbulent or flowing from different angles. 2. **The pushPIN™ Mechanism:** This replaces traditional adhesive or screw mounting. It uses a precision-engineered spring and pin system to ensure even pressure across the surface of the processor or chip. 3. **The Spring:** Made of brass or stainless steel, providing constant tension to ensure the heatsink remains in contact with the component even during mechanical vibrations. 4. **Thermal Interface Material (TIM):** The base is pre-coated with **T766**. This fills microscopic air gaps between the chip and the aluminum, drastically increasing heat transfer efficiency. --- ### 3. Application Use Cases This specific part is typically used in environments where electronic components generate significant heat but have limited space: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and control units. * **Power Electronics:** Cooling MOSFETs or small power modules. * **Automotive:** Electronic Control Units (ECUs) requiring vibration-resistant mounting. --- ### 4. Thermal Performance Data Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 10.03 | 3.64 | 2.13 |