## Technical Specifications for ATS-15H-52-C2-R0 The **ATS-15H-52-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed for efficient thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight | | **Pattern** | Fine-Pitch | | **Thermal Resistance (Unducted)** | 10.79 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.88 °C/W @ 100 LFM | | **Dimensions** | 35mm x 35mm x 15mm | --- ### 2. Component Breakdown #### A. The Heat Sink Body The body is constructed from **Aluminum**, providing a balance between thermal conductivity and weight. The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity and provides corrosion resistance. #### B. The PushPIN™ Mechanism Instead of using messy thermal adhesives or complex screws, this part uses the ATS pushPIN™ system. * **Engagement:** It uses a flexible pin and a stainless steel spring. * **Pressure:** The spring provides precise, uniform pressure across the thermal interface material (TIM), ensuring maximum heat transfer. #### C. Fin Design The **Fine-Pitch** straight fin design is optimized for high-velocity airflow environments. By increasing the surface area within a compact 35mm footprint, it allows heat to dissipate more rapidly into the air stream. --- ### 3. Thermal Performance Matrix Thermal resistance measures how effectively the part moves heat away from the electronic component. Lower numbers indicate better performance. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :---: | :---: | :---: | :---: | :---: | | **Unducted Flow (°C/W)** | 10.79 | 3.88 | 2.23 | 1.61 | 1.30 | | **Ducted Flow (°C/W)** | 1.88 | 1.18 | 0.96 | 0.84 | 0.77 | --- ### 4. Application Use Cases * **Embedded Systems:** Ideal for cooling processors in compact enclosures. * **Telecommunications:** Used in routers and switches where vertical space (15mm) is limited. * **Power Electronics:** Cooling of MOSFETs or voltage regulators. ---