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  • ATS-15H-65-C2-R0

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    The **ATS-15H-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-density electronic cooling. --- ### 1. Technical Specifications The part number encodes specific physical and thermal properties essential for PCB design: | Feature | Specification | Description | | :--- | :--- | :--- | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances emissivity and prevents corrosion | | **Attachment** | pushPIN™ | Spring-loaded plastic pins for secure PCB mounting | | **Dimensions** | 45mm x 45mm | Standard square footprint for ICs | | **Height** | 20mm | Low profile for space-constrained enclosures | | **Thermal Resistance** | 7.29°C/W (Unducted) | Efficiency at 1.0 m/s airflow | --- ### 2. Key Design Components #### A. Fin Profile (Straight Fin) The "65" in the part number indicates the specific fin pattern. Straight fins provide a low pressure drop, making them ideal for systems with high-velocity airflow or forced convection cooling (fans). #### B. pushPIN™ Mounting System Unlike adhesive-based heat sinks, this model uses a mechanical attachment system: * **Compression Springs:** Provide precise, uniform pressure across the interface material. * **Reliability:** Resistant to shock and vibration, making it suitable for industrial or automotive electronics. #### C. Thermal Interface Material (TIM) The **C2** designation typically refers to the pre-applied thermal interface. This is a "Phase Change" or high-conductivity grease that fills microscopic air gaps between the component (CPU/FPGA) and the heat sink base to maximize heat transfer. --- ### 3. Application Use-Cases This specific heat sink is commonly found in: 1. **Networking Hardware:** Switches and routers where airflow is constant. 2. **Power Supplies:** Cooling MOSFETs or power regulators. 3. **Embedded Systems:** Protecting FPGAs or SoCs from thermal throttling. --- ### 4. Part Number Breakdown `ATS - 15 - H - 65 - C2 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **15:** Part Family/Dimensions. * **H:** Attachment type (pushPIN™). * **65:** Fin design/count. * **C2:** Thermal interface material type. * **R0:** RoHS compliance and revision status.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ Can this heat sink be used in a passive cooling (no fan) environment?
    • ⤷ What are the advantages of blue anodized finishes in thermal management?