The **ATS-15H-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for high-density cooling in confined spaces. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 36.9mm x 41.2mm x 10.0mm | | **Thermal Resistance** | 5.86°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Base Shape** | Square/Rectangular | | **Thermal Interface Material (TIM)** | T412 | --- ## 2. Key Design Features ### A. maxiFLOW™ Geometry Unlike standard extruded heat sinks, the maxiFLOW design uses a tapered fin structure. This increases the surface area available for heat dissipation while maintaining a low pressure drop. This is critical for systems with limited airflow. ### B. pushPIN™ Attachment The "R0" at the end of the part number signifies the attachment mechanism. The **pushPIN™** system includes: * A flexible spring-loaded mechanism. * Secure attachment to the PCB through pre-drilled holes. * Consistent pressure across the component to ensure optimal heat transfer. ### C. Blue Anodized Finish The surface is treated with a blue anodized coating. Beyond aesthetics, this provides: * Increased corrosion resistance. * Improved surface emissivity (radiant heat transfer). * Electrical insulation of the heat sink body. --- ## 3. Application Use Cases This specific model is typically used for cooling small to medium-sized integrated circuits (ICs), such as: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **FPGA/ASIC:** Managing heat in programmable logic devices. 3. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators. 4. **Embedded Systems:** Industrial PCs where space is a premium. --- ## 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.86 | | 400 (2.0 m/s) | 4.80 | | 600 (3.0 m/s) | 4.00 |