The **ATS-15H-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 1.62°C/W (at 100 LFM) | | **Airflow Pattern** | Cross-Cut (Omnidirectional) | --- ### 2. Design and Component Breakdown #### A. The Fin Design (Cross-Cut) The "83" in the part number refers to a specific fin configuration. This model uses a **cross-cut** pattern, which creates a grid of small square or rectangular pillars. * **Benefit:** This allows air to flow through the heat sink from any direction (omnidirectional), making it ideal for enclosures where airflow direction might be unpredictable. #### B. Attachment Mechanism (pushPIN™) The part utilizes the ATS pushPIN™ system, which consists of: * **Compression Springs:** These provide precise, even pressure across the thermal interface material (TIM) to ensure maximum heat transfer. * **Push-Pins:** These snap into pre-drilled holes on the PCB, making installation fast and secure without the need for tools. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the heat sink comes with a **pre-applied thermal interface material** (usually a phase-change material or high-performance grease). This fills the microscopic air gaps between the component and the heat sink. --- ### 3. Application Use Cases This specific heat sink is categorized as a "High-Flow" design, suitable for: * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ### 4. Thermal Performance Comparison (LFM) Thermal resistance decreases as the velocity of the air (Linear Feet per Minute) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | |:---|:---| | 100 (0.5 m/s) | 1.62 | | 300 (1.5 m/s) | 1.05 | | 500 (2.5 m/s) | 0.88 |