The **ATS-15H-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of this specific model: | Attribute | Specification | | :--- | :--- | | **Part Number** | ATS-15H-99-C2-R0 | | **Heat Sink Type** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 20.00mm | | **Fin Style** | Fine Pitch (cross-cut) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This part belongs to the **pushPIN™** series, which is engineered for secure and efficient attachment. * **Fin Design:** It features a high-density "Fine Pitch" pattern. This increases the surface area available for convection, making it highly effective in environments with directed airflow. * **Attachment Mechanism:** It utilizes a spring-loaded pushPIN system. This ensures a consistent pressure (mounting force) across the component, which optimizes the heat transfer between the chip and the sink. * **Thermal Interface Material (TIM):** The "C2" in the part number indicates it comes with a high-performance thermal grease pre-applied, reducing assembly time and ensuring a low thermal resistance path. --- ### 3. Thermal Performance Indicators Thermal resistance is measured based on the velocity of the air passing through the fins (LFM - Linear Feet per Minute): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted Flow (200 LFM)** | ~11.52 | | **Ducted Flow (200 LFM)** | ~1.72 | --- ### 4. Typical Applications The ATS-15H-99-C2-R0 is commonly used in: 1. **Telecommunications:** Networking switches and routers. 2. **Industrial PC:** Embedded controllers that require compact but robust cooling. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).