## Technical Overview of ATS-16A-07-C2-R0 The **ATS-16A-07-C2-R0** is a high-performance **heat sink** assembly manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series, specifically designed for cooling electronic components like CPUs, GPUs, and FPGAs in high-airflow environments. --- ### 1. Component Specifications The following table highlights the core physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16A-07-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Thermal Resistance** | 16.97°C/W (Unducted Flow @ 200 LFM) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Parts #### A. The Heat Sink Body * **Design:** It features a **Straight Fin** pattern. This geometry is optimized for high-velocity airflow (ducted or unducted) where air can pass through the fins with minimal resistance. * **Material:** Constructed from high-grade aluminum to balance weight and thermal conductivity. The blue anodized finish provides corrosion resistance and increased emissivity. #### B. The pushPIN™ Attachment System Instead of simple adhesive tapes that can fail under high heat, this part uses a mechanical **pushPIN™** system: * **Springs:** Provides consistent pressure to ensure a secure interface between the heat sink and the chip. * **Plastic/Brass Pins:** Designed to lock into pre-drilled holes on the PCB. * **Function:** Ensures the heat sink does not shift during vibration or shipping, which is critical for industrial electronics. #### C. Thermal Interface Material (TIM) * **T766:** This is a phase-change or high-performance thermal grease pre-applied to the base. * **Purpose:** It fills the microscopic air gaps between the electronic component (heat source) and the aluminum base of the heat sink to maximize heat transfer efficiency. --- ### 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 16.97 | | 400 | 2.0 | 6.22 | | 600 | 3.0 | 4.05 | | 800 | 4.0 | 3.21 | --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** Industrial PCs where mechanical stability is required. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.