The **ATS-16A-101-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-power ICs. ### 1. Technical Specifications The part is defined by its material composition, fin structure, and mounting mechanism. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Fin Style** | Straight Fin | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.67°C/W @ 200 LFM | | **Pressure Drop** | 0.47 in-H2O @ 200 LFM | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the allocated PCB real estate without interfering with surrounding components. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 20.00 mm * **Weight:** Approximately 25-30 grams (varies slightly by batch) --- ### 3. Electronic & Thermal Performance The primary function of this part is to dissipate heat generated by electronic components into the surrounding air. * **Thermal Conductivity:** The aluminum construction provides high thermal conductivity to pull heat away from the die. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer increases **emissivity**, which slightly improves radiative cooling and protects the aluminum from corrosion and electrical shorting in case of accidental contact. * **Flow Dynamics:** The straight fin design is optimized for **forced-air cooling** (airflow from a fan). It offers low resistance to airflow, making it efficient in high-density electronic enclosures. --- ### 4. Mounting Mechanism (The "Push Pin") The "C2-R0" suffix denotes the specific mounting hardware: 1. **Push Pin:** Made of brass, these provide a secure, vibration-resistant connection to the PCB. 2. **Springs:** The compression springs ensure a constant and specific **Downward Pressure** (load). This is vital because it ensures the Thermal Interface Material (TIM) is compressed evenly, reducing the "contact resistance" between the chip and the heat sink. --- ### 5. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Electronics:** Voltage regulators and high-speed processors.