The **ATS-16A-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.02 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Fin Style** | Straight Fin | --- ### 2. Key Component Features * **Push-Pin Attachment:** The part utilizes a brass push-pin mechanism with a compression spring. This ensures a secure attachment to the PCB (Printed Circuit Board) and provides consistent pressure for optimal thermal interface material (TIM) performance. * **High-Aspect Ratio Fins:** The "straight fin" design is engineered to maximize surface area while maintaining a low pressure drop, making it ideal for systems with forced-air cooling (fans). * **Blue Anodized Coating:** The surface treatment is not just aesthetic; it increases thermal emissivity and provides a durable, corrosion-resistant outer layer. * **Pre-drilled Holes:** It comes with pre-drilled holes specifically spaced for industry-standard PCB layouts. --- ### 3. Application Use Cases The ATS-16A-41-C2-R0 is typically used to cool the following electronic components: 1. **CPUs / Microcontrollers:** High-processing units that generate significant localized heat. 2. **FPGAs:** Field Programmable Gate Arrays that require stable temperatures for timing accuracy. 3. **Power Semiconductors:** Transistors or MOSFETs used in power conversion. 4. **Telecom Equipment:** High-density boards where vertical space (25mm height) is available but horizontal space is limited to 40x40mm. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on airflow speed (LFM - Linear Feet per Minute): | Airflow Speed (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 10.02 | | 300 (Moderate) | 3.65 | | 500 (High) | 2.52 |