The **ATS-16A-75-C3-R0** is a specific high-performance electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** Heat Sink Assembly series, designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | pushPIN™ HS Assembly | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 1.57 °C/W (at 100 LFM) | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 20.0mm | --- ### 2. Physical Design and Construction The design focuses on maximizing heat dissipation within a small footprint. * **Fine Pitch Fin Pattern:** The unit uses a "straight fin" or "fine pitch" design which increases surface area. This allows for better airflow interaction and heat transfer from the base to the surrounding air. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or pre-applied phase-change material to ensure no air gaps exist between the heat source and the sink. * **Push-Pin Mounting:** Unlike adhesive-only sinks, this uses a mechanical push-pin system. This provides consistent pressure (preload) which is vital for maintaining thermal contact over the lifetime of the device. --- ### 3. Application Use Cases This component is typically used in industrial and high-reliability electronics where thermal management is critical: 1. **Telecommunications:** Used on high-speed networking chips. 2. **Embedded Systems:** Ideal for compact PC-104 or specialized industrial motherboards. 3. **Power Electronics:** Cooling MOSFETs or small power modules. --- ### 4. Part Number Breakdown The suffixing in the part number provides the following details: * **-75:** Refers to the specific fin design and thermal performance curve. * **-C3:** Indicates the material/performance grade (usually high-performance aluminum). * **-R0:** Refers to the revision code and packaging (standard commercial release).