ATS-16A-89-C2-R0
AI

The **ATS-16A-89-C2-R0** is a specific part number for a high-performance **Heatsink** assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series.
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## 1. Technical Specifications
The following table summarizes the key physical and thermal properties of the device:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Thermal Resistance** | 2.32°C/W (at 100 LFM) |
| **Dimensions** | 35.00mm x 35.00mm |
| **Height** | 30.00mm |
| **Base Fin Type** | Straight |
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## 2. Key Components & Electronics Purpose
### A. The Heatsink Body
Made from extruded aluminum, the "Straight-Fin" design is optimized for environments where airflow is consistent. Its primary purpose is to increase the surface area of an electronic component (like a CPU, FPGA, or Power MOSFET) to dissipate heat more efficiently.
### B. The Attachment System (Push-Pins)
Unlike adhesive tapes or simple clips, the **ATS-16A-89-C2-R0** uses a specialized push-pin mechanism:
* **Plastic or Brass Pins:** These pass through pre-drilled holes in the PCB.
* **Compression Springs:** These ensure a specific "clamping force" (pressure) is applied to the chip, which is critical for maintaining thermal contact.
### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number typically indicates the type of **Thermal Interface Material** pre-applied to the base.
* **Function:** It fills microscopic air gaps between the component and the heatsink.
* **Type:** This specific model usually comes with **T766** (a high-performance thermal pad or phase-change material).
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## 3. Application Examples
This part is commonly found in industrial and telecommunications electronics where reliability is paramount:
1. **Network Switches:** Cooling high-speed processing chips.
2. **Embedded Systems:** Protecting microcontrollers from thermal throttling.
3. **Power Supplies:** Dissipating heat from voltage regulators.
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## 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS-16** | Series Identifier |
| **A** | Push-pin style/size |
| **89** | Specific design geometry (Fin count/spacing) |
| **C2** | High-performance Aluminum / Blue Anodized |
| **R0** | Thermal Interface Material (TIM) and packaging |
- ⤷
What is the required hole size on the PCB for this push-pin assembly?
- ⤷ How does the thermal resistance change at higher airflow velocities (e.g.
- ⤷ 400 LFM)?
- ⤷ Are there copper versions of this heatsink for higher heat dissipation?