Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-16A-89-C2-R0

  • AI
    The **ATS-16A-89-C2-R0** is a specific part number for a high-performance **Heatsink** assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal properties of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 2.32°C/W (at 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 30.00mm | | **Base Fin Type** | Straight | --- ## 2. Key Components & Electronics Purpose ### A. The Heatsink Body Made from extruded aluminum, the "Straight-Fin" design is optimized for environments where airflow is consistent. Its primary purpose is to increase the surface area of an electronic component (like a CPU, FPGA, or Power MOSFET) to dissipate heat more efficiently. ### B. The Attachment System (Push-Pins) Unlike adhesive tapes or simple clips, the **ATS-16A-89-C2-R0** uses a specialized push-pin mechanism: * **Plastic or Brass Pins:** These pass through pre-drilled holes in the PCB. * **Compression Springs:** These ensure a specific "clamping force" (pressure) is applied to the chip, which is critical for maintaining thermal contact. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the type of **Thermal Interface Material** pre-applied to the base. * **Function:** It fills microscopic air gaps between the component and the heatsink. * **Type:** This specific model usually comes with **T766** (a high-performance thermal pad or phase-change material). --- ## 3. Application Examples This part is commonly found in industrial and telecommunications electronics where reliability is paramount: 1. **Network Switches:** Cooling high-speed processing chips. 2. **Embedded Systems:** Protecting microcontrollers from thermal throttling. 3. **Power Supplies:** Dissipating heat from voltage regulators. --- ## 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Code Segment | Meaning | | :--- | :--- | | **ATS-16** | Series Identifier | | **A** | Push-pin style/size | | **89** | Specific design geometry (Fin count/spacing) | | **C2** | High-performance Aluminum / Blue Anodized | | **R0** | Thermal Interface Material (TIM) and packaging |
    ✨ Follow-up Questions
    • ⤷ What is the required hole size on the PCB for this push-pin assembly?
    • ⤷ How does the thermal resistance change at higher airflow velocities (e.g.
    • ⤷ 400 LFM)?
    • ⤷ Are there copper versions of this heatsink for higher heat dissipation?