The **ATS-16B-02-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 18.32°C/W (Unducted @ 100 LFM) | | **Dimension (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 12.70 mm | | **Attachment Type** | Push-pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design The "Electronic" effectiveness of this part relies on its geometry and material properties to manage heat generated by semiconductors: * **Heat Sink Base:** A flat aluminum base that makes direct contact with the electronic chip. It is treated with **T766 thermal phase change material**, which fills microscopic air gaps between the chip and the metal to maximize heat transfer. * **Fin Profile:** This model uses a **fine-pitch fin design**. In electronics, surface area is critical; more fins mean more area for air to carry away heat, allowing for a lower profile (12.7mm) while maintaining high performance. * **Push-Pin Mechanism:** Features a brass pin and a stainless steel spring. This ensures a consistent **compression force** on the electronic component, preventing the heat sink from shifting and ensuring the TIM remains effective under vibration. --- ### 3. Thermal Performance Matrix Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.32 | | 300 (1.5 m/s) | 5.35 | | 500 (2.5 m/s) | 3.59 | | 700 (3.5 m/s) | 2.85 | --- ### 4. Implementation Example If you were calculating the junction temperature ($T_j$) of a component using this heat sink: ```python # Simple Thermal Calculation power_dissipation_watts = 5.0 ambient_temp = 25.0 thermal_resistance = 5.35 # At 300 LFM # Formula: Tj = Tamb + (Pd * Rtheta) junction_temp = ambient_temp + (power_dissipation_watts * thermal_resistance) print(f"Expected Temperature: {junction_temp} °C") # Result: 51.75 °C ```