The **ATS-16B-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc.* --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Thermal Resistance** | 16.97°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | XC (Square Fin) | --- ### 2. Physical Design & Construction * **Fin Pattern (XC):** This model features a "Cross-Cut" or square-fin design. This configuration is highly efficient because it allows for multi-directional airflow, making it ideal for systems where the air direction might change or is turbulent. * **Material:** It is made of **Aluminum 6063**, which offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Coating:** The blue anodization is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. --- ### 3. Mounting Mechanism (pushPIN™) The **R0** suffix indicates the specific mounting hardware used. * **Push-Pin:** It uses a spring-loaded push-pin mechanism. This provides a consistent "Pre-set Compression" force on the chip, ensuring optimal thermal interface material (TIM) contact without over-tightening. * **Springs:** Usually high-performance compression springs to maintain pressure over the product's lifespan. --- ### 4. Thermal Performance Comparison Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better heat dissipation. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.97 | | 300 (1.5 m/s) | 5.92 | | 500 (2.5 m/s) | 3.82 | | 700 (3.5 m/s) | 3.01 | --- ### 5. Common Applications * **BGA Cooling:** Ball Grid Array processors or FPGAs. * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high.