ATS-16B-11-C2-R0
AI

## Technical Overview: ATS-16B-11-C2-R0
The **ATS-16B-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed to provide secure attachment and optimized cooling for electronic components like BGAs (Ball Grid Arrays).
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 18.74°C/W (Unducted @ 100 LFM) |
| **Dimensions** | 50.00mm x 50.00mm x 10.00mm |
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### 2. Component Design & Mechanical Features
The "electronic parts" of this assembly are categorized into three main segments:
#### A. The Heat Sink Body
* **Fins:** It features a **Straight Fin** design, which is ideal for high-velocity airflow environments where pressure drop must be minimized.
* **Base:** A flat, precision-machined base ensures maximum surface contact with the heat-generating component (CPU, GPU, or Power IC).
#### B. The pushPIN™ Attachment System
Instead of using messy adhesives or complicated screw mounts, this part uses a spring-loaded mechanism:
* **Push-Pin:** Allows for quick and secure installation to the PCB through pre-drilled holes.
* **Spring:** A high-tension compression spring provides consistent pressure (approx. 20 PSI) to ensure optimal thermal interface contact.
#### C. Thermal Interface Material (TIM)
* The part usually comes with a **Pre-applied Thermal Interface Material**, which fills microscopic air gaps between the chip and the heat sink to improve heat transfer efficiency.
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### 3. Performance Data (Thermal Resistance)
Thermal resistance measures how effectively the part moves heat away from the electronic component.
| Air Velocity | LFM (Linear Feet per Minute) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| **Low Airflow** | 100 | 18.74 |
| **Medium Airflow** | 300 | 6.78 |
| **High Airflow** | 500 | 4.61 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps identify the exact electronic application:
* **ATS-16**: Series identifier.
* **B**: Attachment style (Push-pin).
* **11**: Specific fin geometry/count.
* **C2**: Material and Finish code (Aluminum, Blue Anodized).
* **R0**: RoHS Compliant version.
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What are the PCB hole requirements for the push-pin attachment used in this model?
- ⤷ How does the straight fin design compare to cross-cut fins in terms of airflow efficiency?
- ⤷ Is this heat sink compatible with standard BGA 50x50mm processors?