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  • ATS-16B-11-C2-R0

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    ## Technical Overview: ATS-16B-11-C2-R0 The **ATS-16B-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed to provide secure attachment and optimized cooling for electronic components like BGAs (Ball Grid Arrays). --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 18.74°C/W (Unducted @ 100 LFM) | | **Dimensions** | 50.00mm x 50.00mm x 10.00mm | --- ### 2. Component Design & Mechanical Features The "electronic parts" of this assembly are categorized into three main segments: #### A. The Heat Sink Body * **Fins:** It features a **Straight Fin** design, which is ideal for high-velocity airflow environments where pressure drop must be minimized. * **Base:** A flat, precision-machined base ensures maximum surface contact with the heat-generating component (CPU, GPU, or Power IC). #### B. The pushPIN™ Attachment System Instead of using messy adhesives or complicated screw mounts, this part uses a spring-loaded mechanism: * **Push-Pin:** Allows for quick and secure installation to the PCB through pre-drilled holes. * **Spring:** A high-tension compression spring provides consistent pressure (approx. 20 PSI) to ensure optimal thermal interface contact. #### C. Thermal Interface Material (TIM) * The part usually comes with a **Pre-applied Thermal Interface Material**, which fills microscopic air gaps between the chip and the heat sink to improve heat transfer efficiency. --- ### 3. Performance Data (Thermal Resistance) Thermal resistance measures how effectively the part moves heat away from the electronic component. | Air Velocity | LFM (Linear Feet per Minute) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | **Low Airflow** | 100 | 18.74 | | **Medium Airflow** | 300 | 6.78 | | **High Airflow** | 500 | 4.61 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps identify the exact electronic application: * **ATS-16**: Series identifier. * **B**: Attachment style (Push-pin). * **11**: Specific fin geometry/count. * **C2**: Material and Finish code (Aluminum, Blue Anodized). * **R0**: RoHS Compliant version.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin attachment used in this model?
    • ⤷ How does the straight fin design compare to cross-cut fins in terms of airflow efficiency?
    • ⤷ Is this heat sink compatible with standard BGA 50x50mm processors?