The **ATS-16B-12-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue" series, designed for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 15.84°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 12.70mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (High Performance Phase Change) | --- ### 2. Breakdown of the Part Number The part number follows a standard nomenclature used by ATS to identify the physical attributes: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **16B**: Part series/family identifier. * **12**: Height (approximately 12.70mm). * **C2**: Indicates the specific thermal performance and material grade. * **R0**: Revision code (standard production version). --- ### 3. Key Electronic/Mechanical Features #### A. pushPIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses the **pushPIN™** system. It consists of a spring-loaded pin that passes through pre-drilled holes in the PCB. This ensures: * Constant pressure (load) on the electronic component. * Increased vibration resistance. * Better thermal contact compared to simple stick-on heat sinks. #### B. Thermal Interface Material (TIM) The base comes pre-applied with **T766**, a phase-change material. This acts as the "bridge" between the electronic chip and the aluminum sink. As the chip heats up, the T766 softens to fill microscopic air gaps, significantly improving heat transfer efficiency. #### C. Aluminum Construction (Blue Anodized) The aluminum provides a high strength-to-weight ratio. The **Blue Anodized finish** is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat emissivity. --- ### 4. Application Context This heat sink is typically used in: 1. **Network Switches/Routers:** For cooling main processing chips. 2. **Power Supplies:** To dissipate heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Where low-profile (12.7mm height) cooling is required due to enclosure constraints.