The **ATS-16B-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Product Series** | pushPIN™ | | **Heat Sink Type** | Fine Pitch (XC Cut) | | **Thermal Resistance** | 3.20°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions** | 50mm x 50mm x 25mm | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal properties of the unit: 1. **ATS-16**: Refers to the specific series and family within the pushPIN™ lineup. 2. **B**: Indicates the revision or specific mechanical design version. 3. **124**: A code representing the base dimensions and fin configuration. 4. **C2**: Indicates the material and finish (typically aluminum with a specific thermal interface material). 5. **R0**: Represents the RoHS compliance status and packaging revision. --- ### 3. Key Features * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures a secure, high-pressure fit against the electronic component for maximum heat transfer. * **XC Cut Fin Design:** Features a "Cross-Cut" or fine-pitch fin pattern. This increases the surface area significantly, allowing for better heat dissipation in forced-air (fan-cooled) environments. * **Pre-Applied Thermal Interface Material (TIM):** Most "C2" variants come with a high-performance thermal pad or grease already applied to the base, simplifying the assembly process. * **Blue Anodized Coating:** Provides corrosion resistance and slightly improves radiative heat transfer. --- ### 4. Application and Use Case This part is typically used in industrial or computing applications where a standard passive heat sink is insufficient. ```markdown Usage Scenario: - Power Supplies (PSUs) - Telecommunications hardware - High-density server components - LED lighting thermal management ```