The **ATS-16B-137-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. It belongs to the *blueICE™* series manufactured by **Advanced Thermal Solutions (ATS)**. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown of its properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 1.83°C/W (at 200 LFM) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height (Height Off Base)** | 10.00mm | | **Fin Pitch** | Fine Pitch | | **Fin Pattern** | Straight Fin | --- ## 2. Component Design & Construction ### A. Fin Geometry This model utilizes a **straight-fin** design. Straight fins are ideal for "unidirectional" airflow (air moving in one clear path). The fine-pitch arrangement increases the surface area for heat dissipation without significantly increasing the physical footprint. ### B. Attachment System: pushPIN™ Unlike adhesive tapes or simple clips, the `pushPIN™` system provides: * **Constant Pressure:** A high-performance compression spring ensures consistent contact between the heat sink and the component. * **Secure Mounting:** It uses pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping. * **Flexibility:** It comes with various spring lengths to accommodate different PCB thicknesses. ### C. Thermal Interface Material (TIM) The "C2" designation typically indicates that the part comes with **ATS-PPS-02** or a similar high-performance thermal interface pre-applied. This fills microscopic air gaps between the heat sink and the chip to maximize heat transfer. --- ## 3. Thermal Performance Comparison Thermal performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.30 | | 200 (1.0 m/s) | 1.83 | | 300 (1.5 m/s) | 1.55 | | 400 (2.0 m/s) | 1.39 | --- ## 4. Typical Applications Due to its small 25mm x 25mm profile, this part is commonly used for: * **Networking Equipment:** Small routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and IoT controllers. * **Power Electronics:** Voltage regulators and high-speed transistors. * **ASICs and FPGAs:** Small-scale logic chips that generate moderate heat.