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  • ATS-16B-14-C2-R0

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    ## Technical Analysis of ATS-16B-14-C2-R0 The **ATS-16B-14-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs where airflow is directed. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Natural)** | 9.97 °C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 20.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Design & Features #### A. Fin Geometry The "16B" designation refers to the specific fin pattern. The maxiFLOW™ design features a **flared fin structure**. This increases the surface area for heat dissipation while maximizing the effectiveness of available airflow in high-density PCB environments. #### B. Attachment System (pushPIN™) Unlike adhesive-based heat sinks, this model uses a **pushPIN™** mechanism: * **Flexibility:** It allows for secure mounting and easy removal. * **Pressure:** The brass or plastic pins (depending on exact kit) are paired with compression springs to provide precise vertical pressure, ensuring optimal contact with the component. * **Reliability:** It prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The part number suffix **C2** indicates the inclusion of **T766** thermal grease. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the component, significantly reducing thermal impedance. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **16B** | Profile / Fin Style (maxiFLOW™) | | **14** | Package Size / Height Code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant | --- ### 4. Application Use Cases * **Network Switches/Routers:** Ideal for high-speed data processing chips. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Industrial Controls:** Protecting PLCs and embedded systems in high-temperature environments. ---
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the maximum thermal efficiency for this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard silicone-based greases?
    • ⤷ Are there specific PCB hole patterns required for the pushPIN attachment?