ATS-16B-14-C2-R0
AI

## Technical Analysis of ATS-16B-14-C2-R0
The **ATS-16B-14-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs where airflow is directed.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance (Natural)** | 9.97 °C/W @ 200 LFM |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 20.00mm |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Component Design & Features
#### A. Fin Geometry
The "16B" designation refers to the specific fin pattern. The maxiFLOW™ design features a **flared fin structure**. This increases the surface area for heat dissipation while maximizing the effectiveness of available airflow in high-density PCB environments.
#### B. Attachment System (pushPIN™)
Unlike adhesive-based heat sinks, this model uses a **pushPIN™** mechanism:
* **Flexibility:** It allows for secure mounting and easy removal.
* **Pressure:** The brass or plastic pins (depending on exact kit) are paired with compression springs to provide precise vertical pressure, ensuring optimal contact with the component.
* **Reliability:** It prevents the heat sink from shifting during vibration or shipping.
#### C. Thermal Interface Material (TIM)
The part number suffix **C2** indicates the inclusion of **T766** thermal grease. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the component, significantly reducing thermal impedance.
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### 3. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **16B** | Profile / Fin Style (maxiFLOW™) |
| **14** | Package Size / Height Code |
| **C2** | Thermal Interface Material (T766) |
| **R0** | RoHS Compliant |
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### 4. Application Use Cases
* **Network Switches/Routers:** Ideal for high-speed data processing chips.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
* **Industrial Controls:** Protecting PLCs and embedded systems in high-temperature environments.
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- ⤷
What are the airflow requirements to achieve the maximum thermal efficiency for this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard silicone-based greases?
- ⤷ Are there specific PCB hole patterns required for the pushPIN attachment?