The **ATS-16B-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin-Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, and power modules. --- ### ## Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Fin Type** | Pin-Fin (provides omnidirectional airflow) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 10.00mm | | **Attachment Method** | pushPIN™ (Brass/Plastic pins with springs) | | **Thermal Resistance** | 15.70°C/W (Unducted flow @ 200 LFM) | --- ### ### Key Electronic & Physical Characteristics 1. **Omnidirectional Cooling:** Unlike straight-fin heat sinks, the **Pin-Fin** design allows air to enter from any direction. This makes it ideal for crowded PCBs where airflow direction might be unpredictable or obstructed. 2. **pushPIN™ Attachment:** The "R0" designation refers to the attachment kit. It uses a spring-loaded push-pin mechanism. This ensures: * **Consistent Pressure:** Even contact across the electronic component for optimal thermal transfer. * **Durability:** High resistance to shock and vibration. 3. **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a similar thermal pad. This eliminates the need for manual paste application and ensures low contact resistance. 4. **Material Conductivity:** The use of **Aluminum 6063** provides a balance between lightweight design and high thermal conductivity (approx. 200 W/m·K). --- ### ### Thermal Performance Data Performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM) moving through the pins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 15.70 | | 400 (2.0 m/s) | 9.20 | | 600 (3.0 m/s) | 7.30 | | 800 (4.0 m/s) | 6.30 | --- ### ### Common Applications * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Used on high-speed data transceivers. * **Power Electronics:** Managing heat for MOSFETs and voltage regulators.