The **ATS-16B-150-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series designed for securing the thermal solution to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 4.82°C/W (at 200 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 25mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Brand (Advanced Thermal Solutions). * **16**: Series identifier (Push-Pin type). * **B**: Material/Fin geometry code. * **150**: Dimension code relating to the specific footprint and height. * **C2**: Material finish (Blue Anodized). * **R0**: Revision code or packaging indicator. --- ### 3. Key Electronic/Mechanical Features * **Thermal Performance:** The cross-cut fin design provides a high surface area, which is critical for dissipating heat from CPUs, GPUs, or high-power MOSFETs via convection. * **Push-Pin Attachment:** The part includes a pre-assembled push-pin and spring mechanism. This ensures consistent pressure on the electronic component, which improves thermal transfer and prevents damage from over-tightening. * **Thermal Interface Material (T766):** The base of the heat sink comes with a pre-applied phase-change material. This fills microscopic air gaps between the chip surface and the heat sink to maximize heat flow. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and corrosion resistance, preventing accidental shorts if the heat sink touches other components. --- ### 4. Typical Applications This component is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Chipset cooling on motherboards. 3. **Industrial Controls:** Power supply modules and motor drivers.