The **ATS-16B-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Thermal Resistance (Flow)** | 12.30°C/W (at 1.0 m/s) | | **Thermal Resistance (Static)** | 16.10°C/W | | **Fin Style** | Straight (maxiFLOW™) | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Design The "166" in the part number identifies the specific fin profile. The maxiFLOW™ design features a flared fin structure which maximizes surface area for convection cooling while minimizing pressure drop. This is critical for high-density electronic enclosures where airflow may be restricted. ### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™** system: * **Precision Springs:** Provides consistent pressure (Pre-assembled). * **Attachment:** Uses a brass or plastic pin that snaps into pre-drilled holes on the PCB. * **Reliability:** Ensures a secure mechanical connection, preventing the heat sink from shifting during vibration or shipping. ### C. Thermal Interface Material (TIM) The **"C3"** suffix indicates that the part comes pre-applied with a high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the electronic component (die) and the heat sink base, significantly reducing thermal resistance. --- ## 3. Part Number Breakdown ```text ATS - 16 B - 166 - C3 - R0 | | | | | | | | | | | └─ Revision Code | | | | └────── TIM/Finish (C3 = High-Perf TIM, Blue Anodize) | | | └──────────── Fin Profile Number | | └───────────────── Dimension/Pin Type Code | └─────────────────── Series (pushPIN™) └───────────────────────── Brand (Advanced Thermal Solutions) ``` --- ## 4. Typical Applications * **BGA (Ball Grid Array) Cooling:** Used for small-form-factor processors. * **Telecommunications:** Cooling of signal processing chips. * **Embedded Systems:** Industrial PCs where active fan cooling is not feasible.