ATS-16B-170-C2-R0
AI

The **ATS-16B-170-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### Technical Specifications
The following table summarizes the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm |
| **Fin Style** | Straight Fin (Cros-cut for airflow efficiency) |
| **Thermal Resistance** | 10.07°C/W (at 200 LFM) |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
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### Key Electronic & Mechanical Components
#### 1. Heat Sink Body (The Fin Array)
The "170" in the part number refers to a specific fin configuration. This part uses a **Straight Fin** design which is optimized for "forced air" environments (where a fan is present). The blue anodized finish is not just for aesthetics; it increases surface emissivity and protects the aluminum from corrosion.
#### 2. Attachment System (Push-Pins & Springs)
Instead of using messy adhesives or thermal tape, this part uses a mechanical **Push-Pin** system.
* **The Pins:** These insert into pre-drilled holes in the Printed Circuit Board (PCB).
* **The Springs:** Provide constant "compressive force" to ensure the heat sink remains in tight contact with the electronic chip, even during vibration or thermal expansion.
#### 3. Thermal Interface Material (TIM)
The base of the ATS-16B-170-C2-R0 comes with **T766** thermal grease or a phase-change pad pre-applied. In electronics, this is critical because it fills microscopic air gaps between the chip surface and the heat sink base, significantly improving heat transfer.
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### Part Number Breakdown
The nomenclature follows a specific logic:
| Code | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **16B** | Series/Product Family |
| **170** | Fin Height/Specific Geometry |
| **C2** | Thermal Interface Material type |
| **R0** | Revision code / RoHS Compliance status |
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### Application Usage
This part is commonly found in:
* **Networking Equipment:** Routers and switches.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
- ⤷
What are the PCB hole diameter requirements for the push-pins on this model?
- ⤷ How does 'Blue Anodized' finishing affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used in passive cooling (no fan) environments?