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  • ATS-16B-174-C2-R0

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    The **ATS-16B-174-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blueICE" series, specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Thermal Resistance** | 3.52°C/W @ 200 LFM (Linear Feet per Minute) | | **Fin Type** | Square Pin Fin (High Efficiency) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This heat sink is engineered for specific airflow conditions to maximize heat dissipation: * **Pin Fin Geometry:** Unlike traditional straight fins, the square pin fin design allows for multi-directional airflow. This is ideal for systems where the direction of the fan exhaust might change or is turbulent. * **pushPIN™ Attachment:** This model uses a spring-loaded mounting system. This ensures even pressure across the surface of the electronic chip, which optimizes the thermal contact and prevents damage during vibration. * **Blue Anodized Coating:** The anodization provides two benefits: it protects the aluminum from corrosion and slightly increases the surface emissivity for better radiant heat transfer. --- ### 3. Electronic Application The **ATS-16B-174-C2-R0** is typically used in the following electronic environments: * **Networking Hardware:** Switches, routers, and high-speed modems where chips operate at high temperatures. * **Embedded Systems:** Industrial PCs and controllers where space is limited but vertical clearance (35mm) is available. * **Telecommunications:** Base stations and power amplifiers that require consistent thermal management. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air passing through the fins: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.30 | | 200 (1.0 m/s) | 3.52 | | 300 (1.5 m/s) | 2.90 | | 400 (2.0 m/s) | 2.58 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive mounting for heat sinks?
    • ⤷ How does 'LFM' impact the selection of a heat sink for a specific PCB?
    • ⤷ Can the T766 thermal interface material be replaced with a different compound?