ATS-16B-174-C2-R0
AI

The **ATS-16B-174-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blueICE" series, specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices.
---
### 1. Technical Specifications
Below are the primary physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm |
| **Thermal Resistance** | 3.52°C/W @ 200 LFM (Linear Feet per Minute) |
| **Fin Type** | Square Pin Fin (High Efficiency) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
---
### 2. Design Characteristics
This heat sink is engineered for specific airflow conditions to maximize heat dissipation:
* **Pin Fin Geometry:** Unlike traditional straight fins, the square pin fin design allows for multi-directional airflow. This is ideal for systems where the direction of the fan exhaust might change or is turbulent.
* **pushPIN™ Attachment:** This model uses a spring-loaded mounting system. This ensures even pressure across the surface of the electronic chip, which optimizes the thermal contact and prevents damage during vibration.
* **Blue Anodized Coating:** The anodization provides two benefits: it protects the aluminum from corrosion and slightly increases the surface emissivity for better radiant heat transfer.
---
### 3. Electronic Application
The **ATS-16B-174-C2-R0** is typically used in the following electronic environments:
* **Networking Hardware:** Switches, routers, and high-speed modems where chips operate at high temperatures.
* **Embedded Systems:** Industrial PCs and controllers where space is limited but vertical clearance (35mm) is available.
* **Telecommunications:** Base stations and power amplifiers that require consistent thermal management.
---
### 4. Thermal Performance Data
Performance varies based on the velocity of the air passing through the fins:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 5.30 |
| 200 (1.0 m/s) | 3.52 |
| 300 (1.5 m/s) | 2.90 |
| 400 (2.0 m/s) | 2.58 |
- ⤷
What is the difference between pushPIN and adhesive mounting for heat sinks?
- ⤷ How does 'LFM' impact the selection of a heat sink for a specific PCB?
- ⤷ Can the T766 thermal interface material be replaced with a different compound?