The **ATS-16B-183-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW" series, designed primarily for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### ## Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-16B-183-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 5.37°C/W (at 200 LFM) | | **Flow Pattern** | Straight Fin | | **Pressure Drop** | Low | --- ### ### Key Electronic & Structural Features #### 1. Thermal Management The core purpose of this part is to dissipate heat from integrated circuits (ICs). By increasing the surface area using a **straight-fin** design, it allows air to flow through and carry heat away from the silicon die. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a specialized mechanical attachment: * **Spring-loaded mechanism:** Provides consistent pressure across the thermal interface material (TIM). * **Brass/Plastic Pins:** Used to secure the sink to the PCB through pre-drilled holes. #### 3. Material and Finish * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Not just for aesthetics; the anodized layer provides slight electrical insulation and protection against corrosion/oxidation. #### 4. Compatibility This heat sink is typically used on square-package components (40mm x 40mm). It is often found in networking equipment, telecommunications, and industrial computing where airflow is directed through the chassis. --- ### ### Performance Summary | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 9.12 | | 200 | 5.37 | | 400 | 3.82 | | 600 | 3.13 |