The **ATS-16B-192-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Key Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 2.35°C/W (at 100 LFM) | | **Hardware** | Brass Push-Pin (plastic pins also available) | --- ### 2. Physical Design & Construction The "C2" and "R0" suffixes in the part number provide specific details regarding the physical build: * **Heat Sink Profile:** It features a **Straight Fin** design. This is optimized for longitudinal airflow within a chassis. * **Material (AL 6063):** Constructed from high-quality aluminum for a balance between weight, thermal conductivity, and cost-efficiency. * **The blue Anodized Finish:** This is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation heat transfer. --- ### 3. Attachment Mechanism: pushPIN™ The **ATS-16B-192-C2-R0** uses a specialized mounting system that includes: 1. **Compression Springs:** These provide precise, even pressure across the thermal interface material (TIM) to maximize heat transfer. 2. **Push-Pins:** These allow for quick, tool-less installation into pre-drilled holes on the PCB. 3. **Flexibility:** The system is designed to accommodate different PCB thicknesses while maintaining consistent downward force. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | |:---|:---|:---| | 100 | 0.5 | 2.35 | | 300 | 1.5 | 1.35 | | 500 | 2.5 | 1.13 | | 700 | 3.5 | 1.01 | --- ### 5. Application Use Cases * **Embedded Systems:** Cooling processors in industrial or network hardware. * **Power Supplies:** Managing heat from high-output power semiconductors. * **Telecommunications:** Used in routers and switches where reliability under continuous load is critical.