The **ATS-16B-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and PCBs. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | XCUT (Cross-cut) | | **Dimensions (L x W)** | 60.00 mm x 60.00 mm | | **Height (H)** | 12.00 mm | | **Pitch** | 53.00 mm | | **Attachment Type** | Push-Pin (Plastic/Brass) | --- ## 2. Component Features ### A. XCUT Fin Design The "XCUT" geometry refers to a cross-cut fin pattern. Unlike straight fins, this design allows for: * **Multi-directional airflow:** It performs well regardless of which way the air is blowing across the PCB. * **Increased Surface Area:** The cross-cuts increase the total area available for heat dissipation. ### B. Push-Pin Attachment Mechanism This part uses a specific push-pin mounting system. * **Spring-loaded:** The pins are paired with springs (often 27mm or 47mm depending on the kit) to ensure consistent pressure (TIM compression) against the heat source. * **Security:** It provides a more robust mechanical connection than simple adhesive tapes. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of pre-applied thermal material. * **T766 Phase Change:** Typically, this part comes with a high-conductivity thermal interface material pre-applied to the base, ensuring low thermal resistance between the chip and the heatsink. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in selecting variants: | Segment | Meaning | | :--- | :--- | | **ATS-16** | ATS internal series identifier | | **B** | Revision/Designator | | **207** | Specific dimension/geometry code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Standard Packaging | --- ## 4. Application Use Cases This heatsink is commonly found in: * **Networking Gear:** Routers, switches, and gateways. * **Embedded Computing:** Industrial PC processors and high-speed FPGAs. * **Power Electronics:** Cooling MOSFETs or power modules where height is restricted (12mm profile).