The part number **ATS-16B-209-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Fin Style** | XC-Cut (Cross-cut) | | **Thermal Resistance** | 6.27°C/W (at 200 LFM) | | **Pressure Drop** | 0.23 inH2O (at 200 LFM) | --- ### 2. Part Number Breakdown (Deciphering the Code) The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16B**: Series identifier (typically relates to the mounting hole patterns/series). * **209**: Specific geometric profile/size code. * **C2**: Material and Finish code (C2 typically indicates **Blue Anodized Aluminum**). * **R0**: Revision or packaging code. --- ### 3. Design and Application Features The **ATS-16B-209-C2-R0** is engineered for efficiency in cramped electronic environments: * **XC-Cut Fin Design:** The "cross-cut" or "pin-fin" style allows for multidirectional airflow. This is critical if the air inside the chassis is not moving in a perfectly linear path. * **Low Profile:** With a height of only **10mm**, it is designed for low-clearance applications such as 1U servers or slim embedded systems. * **Push-Pin Mounting:** Unlike adhesive-backed heatsinks, the push-pin mechanism provides consistent pressure against the chip, ensuring better thermal contact and reliability during mechanical shock or vibration. * **Pre-Applied Thermal Interface Material (TIM):** Most "R0" variants come with a pre-applied high-performance thermal pad or grease on the base to simplify assembly. --- ### 4. Typical Use Cases * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Ensuring longevity in high-temperature environments. * **Telecom Equipment:** Handling the heat dissipation of RF components or logic gates.