### Overview of ATS-16B-210-C2-R0 The **ATS-16B-210-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is specifically designed for component cooling in electronic assemblies where space is limited but high thermal performance is required. --- ### Technical Specifications The following table details the mechanical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ / blueICE™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pegs / Springs) | | **Thermal Resistance** | 5.18°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 12.00mm | | **Weight** | ~45 grams | --- ### Key Features 1. **Low Profile Design**: With a height of only 12mm, this heat sink is ideal for dense PCB layouts or low-profile chassis. 2. **Straight Fin Geometry**: The fins are aligned to allow linear airflow, making it highly efficient in forced-air cooling environments. 3. **pushPIN™ Attachment**: * Uses a spring-loaded mechanism to ensure consistent pressure. * Provides better thermal interface material (TIM) contact compared to adhesive tapes. 4. **Pre-applied TIM**: Typically comes with a high-performance thermal interface material (phase-change or grease) pre-applied to the base for easy installation. --- ### Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.18 | | 200 (1.0 m/s) | 3.62 | | 400 (2.0 m/s) | 2.51 | | 600 (3.0 m/s) | 1.98 | --- ### Application Usage This part is commonly used to cool: * **CPUs/GPUs** in embedded systems. * **ASICs and FPGAs** in networking equipment. * **Power modules** that generate localized heat on a motherboard.