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  • ATS-16B-26-C2-R0

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    The **ATS-16B-26-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Blue Anodized (Finish) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 14.20°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 10.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Features and Construction * **Heat Sink Material:** Constructed from high-quality aluminum for optimal thermal conductivity. The **Blue Anodized** finish increases surface emissivity and provides corrosion resistance. * **Push-Pin Attachment:** The "R0" suffix indicates the specific mounting hardware. This model uses brass push-pins with a stainless steel spring to provide consistent pressure (7-10 lbs) against the heat source, improving thermal transfer. * **Thermal Interface Material (TIM):** This specific part number usually comes pre-applied with **T766** thermal phase change material or grease to bridge the microscopic gaps between the component and the heat sink. * **Low Profile:** With a height of only 10mm, it is designed for space-constrained environments such as 1U servers or thin networking equipment. --- ### 3. Performance Data (Airflow) Thermal performance varies significantly based on the velocity of air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.20 | 3.95 | 2.01 | 1.47 | --- ### 4. Part Number Breakdown Understanding the nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **16:** Fin pitch/style series * **B:** Material/Configuration code * **26:** Specific dimensional footprint * **C2:** Thermal Interface Material (TIM) type * **R0:** Revision and mounting hardware (Push-pin type)
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for mounting this heat sink?
    • ⤷ Can the 'R0' mounting hardware be swapped for screws?
    • ⤷ How does the T766 TIM compare to standard thermal paste?