ATS-16B-26-C2-R0
AI

The **ATS-16B-26-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Body), Blue Anodized (Finish) |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 14.20°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 10.00mm |
| **Fin Style** | Straight Fin |
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### 2. Key Features and Construction
* **Heat Sink Material:** Constructed from high-quality aluminum for optimal thermal conductivity. The **Blue Anodized** finish increases surface emissivity and provides corrosion resistance.
* **Push-Pin Attachment:** The "R0" suffix indicates the specific mounting hardware. This model uses brass push-pins with a stainless steel spring to provide consistent pressure (7-10 lbs) against the heat source, improving thermal transfer.
* **Thermal Interface Material (TIM):** This specific part number usually comes pre-applied with **T766** thermal phase change material or grease to bridge the microscopic gaps between the component and the heat sink.
* **Low Profile:** With a height of only 10mm, it is designed for space-constrained environments such as 1U servers or thin networking equipment.
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### 3. Performance Data (Airflow)
Thermal performance varies significantly based on the velocity of air (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | 100 | 300 | 500 | 700 |
| :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 14.20 | 3.95 | 2.01 | 1.47 |
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### 4. Part Number Breakdown
Understanding the nomenclature:
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **16:** Fin pitch/style series
* **B:** Material/Configuration code
* **26:** Specific dimensional footprint
* **C2:** Thermal Interface Material (TIM) type
* **R0:** Revision and mounting hardware (Push-pin type)
- ⤷
What is the hole pattern requirement for mounting this heat sink?
- ⤷ Can the 'R0' mounting hardware be swapped for screws?
- ⤷ How does the T766 TIM compare to standard thermal paste?