The **ATS-16B-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It belongs to the "push pin" series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The part number itself encodes several key physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 25.25°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W)** | 57.9mm x 36.83mm | | **Height** | 5.84mm (Low Profile) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number Advanced Thermal Solutions uses a standardized naming convention: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **16B:** Series designation (typically refers to the attachment style/fin type). * **31:** Specific size and fin geometry code. * **C2:** Material/Color code (Aluminum, Blue Anodized). * **R0:** Revision code (Standard product). --- ### 3. Key Electronic Functions This component serves as a passive cooling solution to prevent **thermal throttling** or hardware failure in sensitive electronics. #### Thermal Dissipation The heatsink increases the surface area of the heat source (like a CPU, GPU, or MOSFET). The **straight-fin design** is optimized for airflow generated by system fans. #### Mechanical Attachment Unlike adhesive-based heatsinks, the **Push-Pin** system provides: 1. **High Reliability:** Secure mechanical connection that doesn't degrade with heat. 2. **Specific Pressure:** The springs ensure a constant, uniform pressure against the chip, maximizing the effectiveness of the Thermal Interface Material (TIM). #### Pre-applied TIM (T766) The part comes with **T766** thermal grease/pad already applied to the base. This fills microscopic air gaps between the heatsink and the electronic component to lower thermal impedance. --- ### 4. Typical Applications * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators. * **Compact Electronics:** Due to its low profile (5.84mm height), it is ideal for space-constrained enclosures.