ATS-16B-32-C2-R0
AI

The **ATS-16B-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs).
### 1. Technical Specifications
Below are the primary technical parameters for this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized Finish) |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 21.46 °C/W (Unducted) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Features and Design
This part is engineered for applications where space and airflow are critical.
* **Fin Design:** It features a cross-cut or high-performance fin pattern that maximizes surface area while allowing airflow from multiple directions.
* **Thermal Interface:** It comes pre-applied with **T766 phase change material**, which ensures efficient heat transfer between the component (CPU/GPU/FPGA) and the heat sink.
* **Push-Pin Mounting:** The use of a push-pin system with a compression spring provides a precise, consistent pressure on the component, improving thermal contact and protecting the silicon from cracking.
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### 3. Part Number Breakdown (Deciphering the Code)
The part number follows a specific nomenclature used by ATS:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **16B** | Series/Mounting style (Push-pin) |
| **32** | Fin pattern/specific geometric layout |
| **C2** | Material/Finish (Aluminum / Blue Anodized) |
| **R0** | Revision or packaging code |
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### 4. Common Applications
* **Telecommunications:** Cooling of high-speed network switches.
* **Embedded Systems:** Thermal management for SoCs (System on Chips).
* **Industrial Power Supplies:** Cooling MOSFETs or power ICs.
* **Consumer Electronics:** Use in high-end routers or media servers.
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What are the airflow requirements to achieve the rated 21.46 °C/W thermal resistance?
- ⤷ Does this model support custom mounting hole patterns for different PCBs?
- ⤷ What is the weight of the ATS-16B-32-C2-R0 heat sink?