Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-16B-32-C2-R0

  • AI
    The **ATS-16B-32-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 21.46 °C/W (Unducted) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Design This part is engineered for applications where space and airflow are critical. * **Fin Design:** It features a cross-cut or high-performance fin pattern that maximizes surface area while allowing airflow from multiple directions. * **Thermal Interface:** It comes pre-applied with **T766 phase change material**, which ensures efficient heat transfer between the component (CPU/GPU/FPGA) and the heat sink. * **Push-Pin Mounting:** The use of a push-pin system with a compression spring provides a precise, consistent pressure on the component, improving thermal contact and protecting the silicon from cracking. --- ### 3. Part Number Breakdown (Deciphering the Code) The part number follows a specific nomenclature used by ATS: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **16B** | Series/Mounting style (Push-pin) | | **32** | Fin pattern/specific geometric layout | | **C2** | Material/Finish (Aluminum / Blue Anodized) | | **R0** | Revision or packaging code | --- ### 4. Common Applications * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** Thermal management for SoCs (System on Chips). * **Industrial Power Supplies:** Cooling MOSFETs or power ICs. * **Consumer Electronics:** Use in high-end routers or media servers.
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the rated 21.46 °C/W thermal resistance?
    • ⤷ Does this model support custom mounting hole patterns for different PCBs?
    • ⤷ What is the weight of the ATS-16B-32-C2-R0 heat sink?