The **ATS-16B-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "pushPIN™" family of thermal solutions. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 35.00mm x 35.00mm | | **Height (Fin)** | 20.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 17.42°C/W (Unducted) | | **Airflow Pattern** | Straight Fin | --- ### 2. Part Number Breakdown The nomenclature used in the part number provides specific details about its design: * **ATS**: Manufacturer prefix. * **16B**: Series/Batch identification. * **33**: Specific dimensions or profile code. * **C2**: Refers to the thermal interface material (TIM) or specific kit version (usually T766 or similar pre-applied phase change material). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic/Mechanical Features * **pushPIN™ Attachment:** This system features a flexible attachment mechanism that eliminates the need for messy adhesives or screws that might damage delicate PCBs. It uses plastic or brass pins and a compression spring for consistent pressure. * **High Performance Fins:** The straight fin design is optimized for high-density electronic cooling where airflow is predictable. * **Pre-applied TIM:** Usually comes with a high-performance Thermal Interface Material (TIM) already applied to the base to ensure optimal heat transfer from the electronic component (CPU, GPU, or ASIC). * **Material Selection:** Made from 6063 aluminum, which offers a good balance between thermal conductivity, weight, and corrosion resistance. --- ### 4. Applications This part is typically used to cool small to medium-sized surface-mount electronic components, including: 1. **Network Switches & Routers:** Cooling internal processors. 2. **FPGA/ASIC:** Managing heat in programmable logic devices. 3. **Industrial Controls:** Cooling power MOSFETs or high-speed controllers. 4. **Embedded Systems:** For compact thermal management where space is limited.