## Technical Overview: ATS-16B-34-C2-R0 The **ATS-16B-34-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components, typically integrated circuits (ICs) and Ball Grid Arrays (BGAs). --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | cross-cut (Omni-Directional) | | **Attachment Method** | Push-Pin (Brass) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 6.73°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Style** | High-performance pin-fin | --- ### 2. Electronic/Mechanical Components The assembly consists of three primary electronic-mechanical parts: 1. **Heat Sink Body:** * **Material:** Extruded Aluminum. The blue anodized finish is not just for aesthetics; it increases surface emissivity to improve heat radiation and protects the metal from oxidation. * **Design:** The "cross-cut" or pin-fin design allows for multi-directional airflow, making it ideal for electronic enclosures where air direction might be unpredictable. 2. **Push-Pin Attachment System:** * **Brass Pins:** These are used to secure the heat sink to the PCB. Brass provides high durability and resistance to thermal expansion cycles. * **Stainless Steel Springs:** Provide precise downward pressure (compression) to ensure maximum contact between the heat sink base and the electronic component (CPU/GPU/SoC). 3. **Thermal Interface Material (TIM):** * **Pre-Applied Film:** This model usually comes with **T766** phase-change material or similar thermal tape. This fills microscopic air gaps between the component and the heat sink to facilitate efficient heat transfer. --- ### 3. Application Performance The effectiveness of this part is measured by its **Thermal Resistance**. The lower the °C/W value, the better the cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.73 | | 400 (2.0 m/s) | 3.62 | | 600 (3.0 m/s) | 2.53 | --- ### 4. Summary of Use This part is specifically engineered for high-density electronic assemblies where space is limited but heat dissipation is critical. It is commonly found in: * Networking hardware (switches/routers). * Industrial automation controllers. * Power supply modules.