The **ATS-16B-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16B-38-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.42°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 41.28mm x 22.86mm | | **Flow Pattern** | Straight Fin | | **Interface Material** | T766 (Thermal Phase Change Material) | --- ### Component Breakdown #### 1. Heat Sink Design (maxiFLOW™) The "maxiFLOW" design features a high-aspect-ratio fin structure that increases surface area while keeping the pressure drop low. This allows for maximum heat extraction in environments with steady airflow. #### 2. Attachment System (pushPIN™) The part uses a **pushPIN™** mechanism. This is a significant mechanical feature for electronic assemblies because: * It ensures consistent pressure on the component (TIM compression). * The pre-assembled springs and pins reduce installation time and prevent board damage. * It provides a secure vibration-resistant mount. #### 3. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity, which slightly improves heat dissipation through radiation and protects the aluminum from corrosion. #### 4. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance thermal interface. This fills the microscopic air gaps between the component (heat source) and the heat sink base, ensuring efficient heat transfer. --- ### Thermal Performance Overview | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 8.42 | | 200 (1.0 m/s) | 6.42 | | 300 (1.5 m/s) | 5.31 | | 400 (2.0 m/s) | 4.61 | --- ### Applications * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Cooling processors in compact enclosures. * **Power Supplies:** Managing heat in MOSFETs and power modules.