## Electronic Specifications for ATS-16B-41-C3-R0 The **ATS-16B-41-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for cooling specific electronic components like BGA (Ball Grid Array) packages. ### Technical Specifications Table | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16B-41-C3-R0 | | **Thermal Resistance (Flowing)** | 1.62 °C/W (@ 200 LFM) | | **Thermal Resistance (Static)** | 10.21 °C/W (@ Ducted) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Hardware Compatibility** | ATS-HK127-R0 (Spring Kit) | --- ### Component Features and Design #### 1. Thermal Performance The heat sink is designed to dissipate heat from high-power electronic components. The "C3" designation refers to the thermal interface material (TIM) or the specific performance grade, often indicating a **T766 thermal phase change material** pre-applied to the base for optimal heat transfer. #### 2. Fin Configuration * **Type:** Square Fin / Straight Fin. * **Density:** Designed for high-airflow environments to maximize surface area contact with the air. * **Orientation:** The design allows for versatile mounting regardless of airflow direction (omni-directional). #### 3. Mechanical Attachment (pushPIN™) Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system: * **Secure Fit:** Prevents the heat sink from shifting due to vibration or thermal expansion. * **Spring Pressure:** Ensures consistent pressure across the surface of the electronic chip, which is critical for maintaining low thermal resistance. * **Reusability:** Allows for the heat sink to be removed and re-installed during maintenance without damaging the PCB. --- ### Applications This part is commonly used for cooling: * **FPGAs and ASICs:** High-heat processing units. * **CPUs/GPUs:** In embedded or industrial computing systems. * **Network Switches:** High-density electronic assemblies requiring active or passive cooling.