The **ATS-16B-46-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high cooling efficiency in environments with constrained airflow. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 24.89mm | | **Thermal Resistance (Flowing)** | 11.57 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.10 °C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design & Components The ATS-16B-46-C2-R0 is engineered with several critical electronic packaging features: * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered shape to maximize surface area and increase turbulence. This effectively pulls more heat away from the component compared to standard straight-fin designs. * **pushPIN™ Attachment:** This is a mechanical mounting system that utilizes a spring-loaded pin. It provides consistent pressure on the electronic component (like a BGA or CPU), ensuring optimal heat transfer and preventing damage during vibration or shipping. * **T766 Thermal Interface Material:** The part comes with a pre-applied phase-change material. This fills the microscopic air gaps between the heatsink base and the electronic chip, significantly lowering thermal resistance. --- ### 3. Application Use Cases This specific part is typically found in high-density electronic assemblies where thermal dissipation is critical: 1. **Telecommunications:** Cooling for ASICs and FPGAs in network switches. 2. **Embedded Systems:** High-power industrial controllers. 3. **Data Centers:** Low-profile server components that require precise airflow management. ---