ATS-16B-54-C2-R0
AI

The **ATS-16B-54-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** Heat Sink Assembly series, designed for cooling electronic components such as CPUs, GPUs, or power modules.
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## 1. Technical Specifications
Below are the primary mechanical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Product Series** | pushPIN™ Heat Sink |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Fin Type** | Fine Pitch (Square Pattern) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Interface** | T766 (Pre-applied Thermal Grease) |
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## 2. Dimensional Data
The part is categorized as a high-performance, small-to-medium-scale thermal management solution.
* **Height:** 15.00 mm
* **Width:** 35.00 mm
* **Length:** 35.00 mm
* **Pitch (Hole spacing):** 40.00 mm
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## 3. Key Electronic Functions
While the heat sink itself is a passive mechanical part, its role in an electronic system is critical for stability:
### A. Thermal Dissipation
The "Fine Pitch" design maximizes surface area. In electronics, heat is the primary enemy of component longevity. The ATS-16B-54-C2-R0 is designed to transfer heat from the silicon die to the ambient air efficiently.
### B. Structural Attachment (Push-Pin)
Unlike adhesive-based heat sinks, the push-pin mechanism provides:
* **Compression Force:** Ensures even pressure across the component for better heat transfer.
* **Vibration Resistance:** Securely locks into the PCB, preventing the heat sink from shifting during transport or operation.
### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied. This is a high-performance thermal grease that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance.
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## 4. Part Number Decoder
The part number can be broken down to understand its features:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS-16B** | Series and Revision |
| **54** | Specific fin geometry/style |
| **C2** | High-performance material/finish (Blue Anodized) |
| **R0** | RoHS compliance and standard packaging |
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- ⤷
What is the thermal resistance rating (C/W) for this specific heat sink?
- ⤷ Is the ATS-16B-54-C2-R0 compatible with standard BGA components?
- ⤷ How does the push-pin mounting compare to spring-clip mounting in terms of reliability?