The **ATS-16B-62-C2-R0** is a high-performance electronic thermal management component, specifically an **Aluminum Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Base Dimensions** | 40mm x 40mm | | **Height** | 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 200 LFM) | | **Fin Type** | Straight Fin | --- ### 2. Electronic/Physical Components The "part" actually consists of an assembly of several sub-components: 1. **The Heat Sink Body:** Extruded aluminum block with a high surface-area-to-volume ratio. The straight fin design is optimized for airflow in a specific direction. 2. **The pushPIN™ Mechanism:** A specialized fastening system that provides consistent pressure across the thermal interface material (TIM). 3. **The Spring:** A brass or steel spring that ensures the heat sink remains in contact with the electronic chip even under vibration or thermal expansion. 4. **Interface Material (Optional/Pre-applied):** Often comes with a pre-applied phase-change material or thermal pad on the base to fill microscopic air gaps between the chip and the metal. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **16:** Attachment Series (pushPIN™ type). * **B:** Material/Manufacturing Process (Aluminum). * **62:** Specific Footprint/Fin Geometry. * **C2:** Thermal Performance Level / Color (Blue Anodized). * **R0:** Revision/Packaging code. --- ### 4. Applications * **Embedded Systems:** Cooling microprocessors on PCBs. * **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators. * **Networking:** Cooling ASICs in switches and routers.