The **ATS-16B-66-C2-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, designed primarily for cooling high-heat-generating electronic components like BGA (Ball Grid Array) processors. --- ### 1. Technical Specifications Below are the physical and thermal characteristics of this specific component: | Specification | Details | | :--- | :--- | | **Product Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Dimensions** | 45mm x 45mm x 35mm | | **Thermal Resistance** | 5.77 °C/W (at 100 LFM) | | **Fin Style** | Straight (maxiFLOW™ design) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Part Number Breakdown Understanding the nomenclature helps identify the exact configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16B**: Part series (typically refers to the mounting hole patterns/series). * **66**: Refers to the specific fin pattern and height configuration. * **C2**: Indicates the **Thermal Interface Material (TIM)**; C2 usually denotes **T766** (a high-performance thermal pad/grease). * **R0**: Version or revision code. --- ### 3. Key Features * **maxiFLOW™ Design:** Features a flared fin structure that increases surface area for maximum heat dissipation while maintaining low pressure drop. * **pushPIN™ Attachment:** This system allows for secure mounting to the PCB (Printed Circuit Board). The pins are spring-loaded to ensure constant pressure on the chip for optimal heat transfer. * **Blue Anodized Finish:** Provides extra surface protection and improved radiation heat transfer properties. * **Pre-Applied TIM:** Comes with a thermal interface material already applied to the base, reducing assembly time and ensuring consistency. --- ### 4. Typical Applications This component is used in electronic systems where space is limited but thermal loads are high: 1. **Telecommunications:** Network switches and routers. 2. **Computing:** Embedded systems and high-speed processors. 3. **Power Electronics:** Converters and high-output power modules.