The **ATS-16B-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 2.50 °C/W (at 1.0 m/s airflow) | | **Weight** | ~65 Grams | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe the component's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16B**: Series/Package size designation. * **72**: Specific design and fin configuration. * **C3**: Thermal performance class/Material grade. * **R0**: RoHS compliance status (lead-free). --- ### 3. Key Electronic Cooling Features #### A. Fin Design The **Straight Fin** pattern allows for low pressure drop and is ideal for systems with unidirectional airflow. This design maximizes the surface area exposed to the air, facilitating efficient heat dissipation from the base to the surrounding environment. #### B. pushPIN™ Attachment Mechanism Unlike traditional adhesive-based heat sinks, this part uses a mechanical **pushPIN™** system. * **Compression Springs:** Provide precise pressure to ensure the thermal interface material (TIM) makes optimal contact with the electronic component. * **Reliability:** Mechanical mounting is more durable than tape in high-vibration or high-heat environments. #### C. Thermal Performance Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). A value of 2.50 indicates that for every watt of heat the electronic chip generates, the temperature of the chip will rise 2.5 degrees above the ambient air temperature (assuming standard airflow). --- ### 4. Application Areas This heat sink is typically used for cooling: 1. **Microprocessors (CPUs):** Low to mid-power embedded processors. 2. **FPGAs & ASICs:** High-speed signal processing chips that generate localized heat. 3. **Power Electronics:** Voltage regulators or MOSFETs in industrial power supplies. 4. **Network Hardware:** Cooling chips in routers and switches.